Reliable transportation mechanism for micro solder balls

ABSTRACT

A solder ball bonding (SBB) tool includes a rotatable feed plate for transporting solder balls from a translatable solder ball reservoir to a nozzle unit, which is a position at which a laser light source can irradiate and thus melt the solder balls. The SBB tool includes a gap between the reservoir and the feed plate positioned over the reservoir, and a feed mechanism coupled with the reservoir, where the feed mechanism is driven by a pressurized gas to translate the reservoir upward across at least a portion of the gap in preparation for movement of a solder ball to the feed plate and downward in preparation for rotation of the feed plate after a solder ball is moved to the feed plate. The gap may have a maximum size that exceeds a nominal size of the solder balls contained in the reservoir.

FIELD OF THE INVENTION

Embodiments of the invention relate to a reliable transportationmechanism for a solder ball bonding device.

BACKGROUND

A hard-disk drive (HDD) is a non-volatile storage device that is housedin a protective enclosure and stores digitally encoded information on atleast one circular disk having magnetic surfaces. When an HDD is inoperation, each magnetic-recording disk is rapidly rotated by a spindlesystem. Information is read from and written to a magnetic-recordingdisk using a read-write head that is positioned over a specific locationof a disk by an actuator. A read-write head uses a magnetic field toread information from and write information to the surface of amagnetic-recording disk. A write head makes use of the electricityflowing through a coil, which produces a magnetic field. Electricalpulses are sent to the write head, with different patterns of positiveand negative currents. The current in the coil of the write head inducesa magnetic field across the gap between the head and the magnetic disk,which in turn magnetizes a small area on the recording medium.

An HDD includes at least one head gimbal assembly (HGA) that typicallyincludes a slider housing a read/write head (also referred to as a “headslider”), a lead suspension with which the head slider is coupled, and aload beam with which the suspension is coupled. The head slider isattached at the distal end of the load beam to a gimbal mechanism.Typically, the head slider is electrically interconnected to the leadsuspension via connection pads on the respective components, which aresolder ball bonded together to form the final electrical interconnectionbetween the components. One solder ball bonding procedure places asolder ball between the connection pad of the head slider and theconnection pad of the suspension, reflows the solder ball by using laserlight, and electrically interconnects the connection pad of the headslider and the connection pad of the suspension.

One particular approach to solder ball bonding very small components,such as a head slider to a suspension, is through use of a solder ballbonding (SBB) tool that includes a solder ball reservoir or tank inpositional relation to a rotatable feed plate. A supply of solder balls(or “micro solder balls”) is housed in the reservoir, from which solderballs are fed one-by-one to the rotatable feed plate. The feed platethen rotates into one or more other process positions for enablingirradiation of and ejection of solder balls onto the workpieces to beinterconnected, such as the head slider and the suspension. However,such SBB tools may tend to clog, whereby a solder ball may beinadvertently captured or lodged between the reservoir and the feedplate and consequently deformed, possibly causing a number ofmalfunctions of the SBB tool and associated bonding process.

Any approaches described in this section are approaches that could bepursued, but not necessarily approaches that have been previouslyconceived or pursued. Therefore, unless otherwise indicated, it shouldnot be assumed that any of the approaches described in this sectionqualify as prior art merely by virtue of their inclusion in thissection.

SUMMARY OF EMBODIMENTS

Embodiments of the invention are directed at a solder ball bonding (SBB)tool and a method of solder ball bonding work pieces, such as componentsof a head gimbal assembly (HGA) of a hard-disk drive (HDD). The SBB toolcomprises a rotatable feed plate for transporting solder balls from atranslatable solder ball reservoir to a nozzle unit, which is in aposition at which a laser light source can irradiate and thus melt thesolder balls. The melted solder ball is then able to be ejected from anozzle and onto one or more work pieces, for electricallyinterconnecting the work pieces.

Embodiments include a gap between the reservoir and the feed platepositioned over the reservoir, and a feed mechanism coupled with thereservoir, where the feed mechanism is driven by a pressurized gas totranslate the reservoir upward in preparation for movement of a solderball to the feed plate and downward in preparation for rotation of thefeed plate after a solder ball is moved to the feed plate. Embodimentsfurther include a gap having a maximum size that exceeds a nominal sizeof solder balls housed or contained in the reservoir.

Embodiments discussed in the Summary of Embodiments section are notmeant to suggest, describe, or teach all the embodiments discussedherein. Thus, embodiments of the invention may contain additional ordifferent features than those discussed in this section. Furthermore, nolimitation, element, property, feature, advantage, attribute, or thelike expressed in this section, which is not expressly recited in aclaim, limits the scope of any claim in any way.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments are illustrated by way of example, and not by way oflimitation, in the figures of the accompanying drawings and in whichlike reference numerals refer to similar elements and in which:

FIG. 1 is a plan view of an HDD, according to an embodiment;

FIG. 2A, FIG. 2B, and FIG. 2C are cross-sectional side viewsillustrating a solder ball jet process using a multi-hole feed plate ofa solder ball bonding tool, according to an embodiment;

FIG. 3 is a cross-sectional side view of a clogged solder ball bondingtool;

FIG. 4A, FIG. 4B, and FIG. 4C are cross-sectional side viewsillustrating a solder ball capture process using a multi-hole feed plateof a solder ball bonding tool, according to an embodiment;

FIG. 5A and FIG. 5B are cross-sectional side views illustrating a solderball feeder of a solder ball bonding tool, according to an embodiment;and

FIG. 6 is a flow diagram illustrating a method of solder ball bondingtwo work pieces using a rotatable feed plate, according to anembodiment.

DETAILED DESCRIPTION

Approaches to a reliable transportation mechanism for a solder ballbonding tool are described. In the following description, for thepurposes of explanation, numerous specific details are set forth inorder to provide a thorough understanding of the embodiments of theinvention described herein. It will be apparent, however, that theembodiments of the invention described herein may be practiced withoutthese specific details. In other instances, well-known structures anddevices are shown in block diagram form in order to avoid unnecessarilyobscuring the embodiments of the invention described herein.

Physical Description of Illustrative Operating Context

Embodiments may be used in the context of inhibiting the clogging of asolder ball bonding tool, such as but not limited to a tool that may beused for bonding a head slider to a suspension of a head gimbal assembly(HGA) of a hard disk drive (HDD) storage device. Thus, in accordancewith an embodiment, a plan view illustrating an HDD 100 is shown in FIG.1 to illustrate an exemplary operating context.

FIG. 1 illustrates the functional arrangement of components of the HDD100 including a slider 110 b that includes a magnetic read-write head110 a. Collectively, slider 110 b and head 110 a may be referred to as ahead slider. The HDD 100 includes at least one head gimbal assembly(HGA) 110 including the head slider, a lead suspension 110 c attached tothe head slider typically via a flexure, and a load beam 110 d attachedto the lead suspension 110 c. The HDD 100 also includes at least onerecording medium 120 rotatably mounted on a spindle 124 and a drivemotor (not visible) attached to the spindle 124 for rotating the medium120. The read-write head 110 a, which may also be referred to as atransducer, includes a write element and a read element for respectivelywriting and reading information stored on the medium 120 of the HDD 100.The medium 120 or a plurality of disk media may be affixed to thespindle 124 with a disk clamp 128.

The HDD 100 further includes an arm 132 attached to the HGA 110, acarriage 134, a voice-coil motor (VCM) that includes an armature 136including a voice coil 140 attached to the carriage 134 and a stator 144including a voice-coil magnet (not visible). The armature 136 of the VCMis attached to the carriage 134 and is configured to move the arm 132and the HGA 110 to access portions of the medium 120, all collectivelymounted on a pivot shaft 148 with an interposed pivot bearing assembly152. In the case of an HDD having multiple disks, the carriage 134 maybe referred to as an “E-block,” or comb, because the carriage isarranged to carry a ganged array of arms that gives it the appearance ofa comb.

An assembly comprising a head gimbal assembly (e.g., HGA 110) includinga flexure to which the head slider is coupled, an actuator arm (e.g.,arm 132) and/or load beam to which the flexure is coupled, and anactuator (e.g., the VCM) to which the actuator arm is coupled, may becollectively referred to as a head stack assembly (HSA). An HSA may,however, include more or fewer components than those described. Forexample, an HSA may refer to an assembly that further includeselectrical interconnection components. Generally, an HSA is the assemblyconfigured to move the head slider to access portions of the medium 120for read and write operations.

With further reference to FIG. 1, electrical signals (e.g., current tothe voice coil 140 of the VCM) comprising a write signal to and a readsignal from the head 110 a, are transmitted by a flexible cable assembly(FCA) 156 (or “flex cable”). Interconnection between the flex cable 156and the head 110 a may include an arm-electronics (AE) module 160, whichmay have an on-board pre-amplifier for the read signal, as well as otherread-channel and write-channel electronic components. The AE module 160may be attached to the carriage 134 as shown. The flex cable 156 may becoupled to an electrical-connector block 164, which provides electricalcommunication, in some configurations, through an electricalfeed-through provided by an HDD housing 168. The HDD housing 168 (or“enclosure base” or simply “base”), in conjunction with an HDD cover,provides a semi-sealed (or hermetically sealed, in some configurations)protective enclosure for the information storage components of the HDD100.

Other electronic components, including a disk controller and servoelectronics including a digital-signal processor (DSP), provideelectrical signals to the drive motor, the voice coil 140 of the VCM andthe head 110 a of the HGA 110. The electrical signal provided to thedrive motor enables the drive motor to spin providing a torque to thespindle 124 which is in turn transmitted to the medium 120 that isaffixed to the spindle 124. As a result, the medium 120 spins in adirection 172. The spinning medium 120 creates a cushion of air thatacts as an air-bearing on which the air-bearing surface (ABS) of theslider 110 b rides so that the slider 110 b flies above the surface ofthe medium 120 without making contact with a thin magnetic-recordinglayer in which information is recorded. Similarly in an HDD in which alighter-than-air gas is utilized, such as helium for a non-limitingexample, the spinning medium 120 creates a cushion of gas that acts as agas or fluid bearing on which the slider 110 b rides.

The electrical signal provided to the voice coil 140 of the VCM enablesthe head 110 a of the HGA 110 to access a track 176 on which informationis recorded. Thus, the armature 136 of the VCM swings through an arc180, which enables the head 110 a of the HGA 110 to access varioustracks on the medium 120. Information is stored on the medium 120 in aplurality of radially nested tracks arranged in sectors on the medium120, such as sector 184. Correspondingly, each track is composed of aplurality of sectored track portions (or “track sector”) such assectored track portion 188. Each sectored track portion 188 may includerecorded information, and a header containing error correction codeinformation and a servo-burst-signal pattern, such as anABCD-servo-burst-signal pattern, which is information that identifiesthe track 176. In accessing the track 176, the read element of the head110 a of the HGA 110 reads the servo-burst-signal pattern, whichprovides a position-error-signal (PES) to the servo electronics, whichcontrols the electrical signal provided to the voice coil 140 of theVCM, thereby enabling the head 110 a to follow the track 176. Uponfinding the track 176 and identifying a particular sectored trackportion 188, the head 110 a either reads information from the track 176or writes information to the track 176 depending on instructionsreceived by the disk controller from an external agent, for example, amicroprocessor of a computer system.

An HDD's electronic architecture comprises numerous electroniccomponents for performing their respective functions for operation of anHDD, such as a hard disk controller (“HDC”), an interface controller, anarm electronics module, a data channel, a motor driver, a servoprocessor, buffer memory, etc. Two or more of such components may becombined on a single integrated circuit board referred to as a “systemon a chip” (“SOC”). Several, if not all, of such electronic componentsare typically arranged on a printed circuit board that is coupled to thebottom side of an HDD, such as to HDD housing 168.

References herein to a hard disk drive, such as HDD 100 illustrated anddescribed in reference to FIG. 1, may encompass an information storagedevice that is at times referred to as a “hybrid drive”. A hybrid driverefers generally to a storage device having functionality of both atraditional HDD (see, e.g., HDD 100) combined with solid-state storagedevice (SSD) using non-volatile memory, such as flash or othersolid-state (e.g., integrated circuits) memory, which is electricallyerasable and programmable. As operation, management and control of thedifferent types of storage media typically differ, the solid-stateportion of a hybrid drive may include its own corresponding controllerfunctionality, which may be integrated into a single controller alongwith the HDD functionality. A hybrid drive may be architected andconfigured to operate and to utilize the solid-state portion in a numberof ways, such as, for non-limiting examples, by using the solid-statememory as cache memory, for storing frequently-accessed data, forstoring I/O intensive data, and the like. Further, a hybrid drive may bearchitected and configured essentially as two storage devices in asingle enclosure, i.e., a traditional HDD and an SSD, with either one ormultiple interfaces for host connection.

INTRODUCTION

Recall that one possible approach to solder ball bonding very smallcomponents, such as a head slider to a suspension, is through use of asolder ball bonding (SBB) tool that includes a solder ball reservoir ortank in positional relation to a rotatable feed plate. A supply ofsolder balls (or “micro solder balls”) is housed in the reservoir, fromwhich solder balls are fed one-by-one to the rotatable feed plate. Thefeed plate then rotates into one or more other process positions forenabling irradiation of and ejection of solder balls onto the workpiecesto be interconnected, such as the head slider and the suspension.

One such SBB tool is described and illustrated in U.S. patentapplication Ser. No. 13/767,023 filed on Feb. 14, 2013, and entitled“High-Speed Transportation Mechanism For Micro Solder Balls”, the entirecontent of which is incorporated by reference for all purposes as iffully set forth herein.

FIG. 2A, FIG. 2B, and FIG. 2C are cross-sectional side viewsillustrating a solder ball jet process using a multi-hole feed plate ofa solder ball bonding tool, according to an embodiment. The maincomponents of an SBB tool 200 comprise a solder ball reservoir 202having an exit opening 201, a nozzle unit 204, a nozzle 206, a laserlight source 210 (FIGS. 2B, 2C), and feed plate 212. The solder ballreservoir 202 is configured for housing, or containing, a plurality ofsolder balls 203. The nozzle unit 204 is configured for directing asolder ball into the nozzle 206 and for facilitating the ejection of thesolder ball from the nozzle 206 onto one or more work piece 216, using apressurized gas. The laser light source 210 is configured forirradiating, with laser light 208 (FIGS. 2B, 2C), a solder ball 215residing in nozzle 206. Irradiating solder ball 215 with the laser light208 causes solder ball 215 to melt, or at least begin to melt orpartially melt, so that the melted solder ball 215 can be ejected fromnozzle 206 onto the one or more work piece 216.

SBB tool 200 is configured such that the feed plate 212 rotates so thatsolder ball holes 213 a-n and laser holes 214 a-214 n, which may bepositioned alternately in the feed plate 212, rotate past the solderball reservoir 202 and the nozzle unit 204. Solder ball holes 213 a-nare configured for receiving solder balls 203 from solder ball reservoir202 through the exit opening 201 as each solder ball hole 213 a-nrotates past the reservoir 202. As the feed plate 212 rotates and asolder ball hole 213 a-n is positioned over the solder ball reservoir202, compressed gas is blown through the reservoir 202 (e.g., from belowthe reservoir 202) to create suction and thus force solder ball 215through the exit opening 201 into a solder ball hole 213 a-n positionedabove the reservoir 202.

FIG. 2B illustrates the feed plate 212 rotated to a position past itsposition in FIG. 2A. As such, the solder ball hole 213 a-n is no longerabove the solder ball reservoir 202 and is rotating toward a positionover the nozzle unit 204. As the feed plate 212 is rotating from aposition over the solder ball reservoir 202 to a position over thenozzle unit 204, a suction force may be continuously applied to thesolder ball 215 so that solder ball 215 remains housed in the solderball hole 213 a-n.

FIG. 2C illustrates the feed plate 212 rotated to a position past itsposition in FIG. 2B. As such, the subject solder ball hole 213 a-n hasnow rotated past the nozzle unit 204 and has ejected solder ball 215into the nozzle 206 of nozzle unit 204. Solder ball 215 can be ejectedinto the nozzle 206 via gravity or via a compressed gas. At this stageof the process, a laser hole 214 a-214 n is now positioned over thenozzle unit 204 such that laser light source 210 can irradiate and meltthe solder ball 215 currently positioned in nozzle 206, with laser light208. Laser holes 214 a-214 n function as an aperture through which thelaser light 208 produced by laser light source 210 is incident upon thesolder ball 215. Once the solder ball 215 has been at least partiallymelted by the laser light 208, the melted solder ball 215 is ejectedonto one or more work piece 216, typically by a compressed inert gassuch as nitrogen gas.

Interconnecting by solder ball bonding according to an embodimentinterconnects the connection pads of the head slider (e.g., slider 110 band head 110 a of FIG. 1) to the connection pads on the gimbal orsuspension. In an HGA having a micro actuator, the connection pads ofthe head slider and the connection pads of the micro actuator, or theconnection pads of the micro actuator and the connection pads of thegimbal/suspension, are also interconnected. However, use of thedescribed embodiments of the invention are not limited to use formanufacturing an HGA or an HDD. Rather, embodiments may be implementedfor use in any micro solder ball bonding process.

While the foregoing SBB tool 200 and approach are effective, such an SBBtool may at times have issues with clogging, whereby a solder ball maybe inadvertently captured or lodged between the reservoir 202 and thefeed plate 212. Consequent deformation of the lodged solder ball maypossibly cause a malfunction of the SBB tool 200 and the associatedbonding process. For example, FIG. 3 is a cross-sectional side view of aclogged solder ball bonding tool. FIG. 3 depicts the SBB tool 200comprising the solder ball reservoir 202 positioned beneath, below therotatable feed plate 212. The rotatable feed plate 212 is shown with asolder ball 203 a captured within a solder ball hole 213 a-n. As thesolder ball hole 213 a-n of the feed plate 212 is rotating away from theexit opening 201 of the reservoir 202, a second solder ball 203 b isdepicted as undesirably lodged, or clogged, in a fixed gap 320 betweenthe reservoir 202 and the feed plate 212.

Translatable Solder Ball Reservoir for Solder Ball Bonding Tool

FIG. 4A, FIG. 4B, and FIG. 4C are cross-sectional side viewsillustrating a solder ball capture process using a multi-hole feed plateof a solder ball bonding tool, according to an embodiment. FIGS. 4A-4Cdepict a SBB tool 400 comprising a translatable solder ball reservoir402, having an exit opening 401 and containing solder balls 203.Reservoir 402 is positioned beneath or below the rotatable feed plate212, having solder ball holes 213 a-n, with a variable gap 420 betweenthe reservoir 402 and the feed plate 212. FIG. 4A further depicts thatthe reservoir 402 and the feed plate 212 are in a positionalrelationship, i.e., they are positioned relative to each other, suchthat the variable gap 420 is at a position of larger gap 420 a (ascompared with a position of smaller gap 420 b of FIG. 4B).

FIG. 4B again depicts the translatable solder ball reservoir 402, havingan exit opening 401 (FIG. 4A) and containing solder balls 203, andpositioned beneath or below the rotatable feed plate 212 having solderball holes 213 a-n. FIG. 4B further depicts that the reservoir 402 andthe feed plate 212 are in a positional relationship such that thevariable gap 420 (FIG. 4A) is at a position of smaller gap 420 b (ascompared to the larger gap 420 a of FIG. 4A). The rotatable feed plate212 is shown with a solder ball 203 c captured within a solder ball hole213 a-n.

SBB tool 400 operates in a manner such that when the feed plate 212 isrotating in preparation for receiving one of the solder balls 203, thatis, when a solder ball hole 213 a-n is approaching and/or over the exitopening 401, the reservoir 402 translates (or moves, such as linearly)upward in the vertical direction across at least a portion of the largergap 420 a to a position of smaller gap 420 b. Hence, and with referenceto FIG. 4C, as the solder ball hole 213 a-n of the feed plate 212 isrotating away from the exit opening 401 of the reservoir 402, SBB 400 isinhibited from and less likely to experience a lodged or clogged solderball within the variable gap 420 (FIG. 4A), in contrast with thatillustrated and described in reference to the fixed gap 320 of FIG. 3.Furthermore, SBB tool 400 operates in a manner such that when the feedplate 212 is rotating away from the exit opening 401 of the reservoir402 in preparation for irradiating the solder ball 203 c captured withinthe solder ball hole 212 a-213 n, the reservoir 402 translates (ormoves) downward in the vertical direction to a new position relative tothe feed plate 212, having a gap 420 n therebetween.

According to an embodiment, a maximum size of the variable gap 420 isgreater than (or exceeds) a nominal size of the solder balls 203 housedor contained within the reservoir 402. Thus, when the reservoir 402translates upward to close or contract the variable gap 420 for moving asolder ball 203 c into a solder ball hole 213 a-n of the feed plate 212,and translates downward to expand the variable gap 420 for rotating thesolder ball hole 213 a-n of feed plate 212 away from the exit opening401 of the reservoir 402, the possibility that a solder ball 203 getslodged within the variable gap 420 is diminished, if not eliminated.

Solder Ball Feeder for Solder Ball Bonding Tool

FIG. 5A and FIG. 5B are cross-sectional side views illustrating a solderball feeder of a solder ball bonding (SBB) tool, according to anembodiment. Feeder 500 is positioned beneath the feed plate 212 andcomprises a solder ball feed mechanism 502 coupled with the solder ballreservoir 402, with a variable gap 420 therebetween. With referencefirst to FIG. 5A, feed mechanism 502 comprises or is coupled with acompressed gas source 508 which supplies a compressed (pressurized) gas508 a (such as an inert or non-reactive gas, such as nitrogen) through acentral chamber and into the reservoir 402, thus functioning to blow ormove a solder ball 203 to the feed plate 212 (e.g., into a solder ballhole 213 a-n of the feed plate 212 of FIGS. 4A-4C).

Feeder 500 further comprises an upward translation gas source 504, whichsupplies a compressed (pressurized) gas 504 a (such as air) thatfunctions to translate upward the feed mechanism 502 and the reservoir402 coupled therewith (where the upward translation is illustrated withupward arrow 505). Hence, in conjunction with the operation of the gassource 508 supplying pressurized gas 508 a to the reservoir 402 to movea solder ball 203 to the feed plate 212, the upward translation gassource 504 supplies pressurized gas 504 a to the feed mechanism 502 totranslate the feed mechanism 502 upward toward the feed plate 212,thereby reducing the variable gap 420. According to an embodiment, thefeed mechanism 502 and reservoir 402 are translated upward just beforethe pressurized gas 508 a is supplied to the reservoir 402 to move asolder ball 203 to the feed plate 212. Thus, the variable gap 420 isreduced by way of the upward translation of the feed mechanism 502 andthe reservoir 402 just prior to the movement of the solder ball 203supply upward within the reservoir 402, thereby inhibiting oreliminating the likelihood of a solder ball 203 inadvertently andundesirably lodging between the reservoir 402 and the feed plate 212.However, while the foregoing operations are described as occurring inseries, in practice the foregoing operations may be implemented to occureffectively simultaneously or concurrently.

With reference to FIG. 5B, the operation of the compressed gas source508 can be reversed, so as to apply a negative pressure 508 b throughthe central chamber and to the reservoir 402, thus functioning to allowthe supply of solder balls 203 in the reservoir 402 to fall back downwithin the reservoir 402. Feeder 500 further comprises a downwardtranslation gas source 506, which supplies a compressed (pressurized)gas 506 a (such as air) that functions to translate downward the feedmechanism 502 and the reservoir 402 coupled therewith (where thedownward translation is illustrated with downward arrow 507). Hence, inconjunction with the operation of the gas source 508 supplying anegative pressure 508 b to the reservoir 402 to allow the supply ofsolder balls 203 to retreat away from the opening 401 (FIGS. 4A, 4C) ofthe reservoir 402, the downward translation gas source 506 suppliespressurized gas 506 a to the feed mechanism 502 to translate the feedmechanism 502 downward away from the feed plate 212, thereby increasingthe variable gap 420. According to an embodiment, the feed mechanism 502and reservoir 402 are translated downward just before the feed plate 212is rotated such that the solder ball hole 213 a-n of the feed plate 212is rotating away from the exit opening 401 of the reservoir 402 (such asdescribed and illustrated in reference to FIG. 4C). Thus, the variablegap 420 is increased by way of the downward translation of the feedmechanism 502 and the reservoir 402 just prior to the rotation of thefeed plate 212, thereby inhibiting or eliminating the likelihood of asolder ball 203 inadvertently and undesirably lodging between thereservoir 402 and the feed plate 212. However, while the foregoingoperations are described as occurring in series, in practice theforegoing operations may be implemented to occur effectivelysimultaneously or concurrently.

A Method of Solder Ball Bonding Work Pieces

FIG. 6 is a flow diagram illustrating a method of solder ball bondingtwo work pieces using a rotatable feed plate, according to anembodiment. The method depicted in FIG. 6 may be implemented for usewith the mechanisms described and illustrated in reference to FIGS.4A-4C and FIGS. 5A, 5B.

At block 602, a solder ball reservoir is translated upward toward arotatable feed plate in preparation for the feed plate receiving asolder ball from the reservoir. For example, solder ball reservoir 402(FIG. 5A) is translated upward 505 (FIG. 5A) toward the rotatable feedplate 212 in preparation for the feed plate 212 receiving a solder ball203 (FIG. 5A) from the reservoir 402. The manner in which the reservoir402 is translated upwardly toward the feed plate 212 may be implementedusing a gas source 504 that supplies a pressurized gas 504 a (such asair) to translate the feed mechanism 502 as, or similar to as, describedin reference to FIG. 5A.

At block 604, a solder ball is moved from the reservoir to the feedplate. For example, a solder ball 203 (FIG. 5A) is moved from thereservoir 402 (FIG. 5A) to the feed plate 212 (FIG. 5A). The manner inwhich the solder ball 203 is moved from the reservoir 402 to the feedplate 212 may be implemented using a gas source 508 supplying apressurized gas 508 a to the reservoir 402 as, or similar to as,described in reference to FIG. 5A.

At block 606, the solder ball reservoir is translated downward away fromthe feed plate in preparation for rotating the feed plate. For example,solder ball reservoir 402 (FIG. 5B) is translated downward 507 (FIG. 5B)away from the rotatable feed plate 212 (FIG. 5B) in preparation forrotating the feed plate 212. The manner in which the reservoir 402 istranslated downwardly away from the feed plate 212 may be implementedusing a gas source 506 that supplies a pressurized gas 506 a (such asair) to translate the feed mechanism 502 as, or similar to as, describedin reference to FIG. 5B. According to an embodiment, prior totranslating the solder ball reservoir downward away from the feed plate(block 606), a negative pressure may be applied inside of the reservoirto allow the supply of solder balls 203 (FIG. 5B) in the reservoir 402to fall back down within the reservoir 402, such as described inreference to FIG. 5B.

At block 608, the feed plate is rotated. For example, the feed plate 212is rotated such that the solder ball hole 213 a-n (FIG. 4C) of the feedplate 212 is rotating away from the exit opening 401 (FIG. 4C) of thereservoir 402.

EXTENSIONS AND ALTERNATIVES

In the foregoing description, embodiments of the invention have beendescribed with reference to numerous specific details that may vary fromimplementation to implementation. Therefore, various modifications andchanges may be made thereto without departing from the broader spiritand scope of the embodiments. Thus, the sole and exclusive indicator ofwhat is the invention, and is intended by the applicants to be theinvention, is the set of claims that issue from this application, in thespecific form in which such claims issue, including any subsequentcorrection. Any definitions expressly set forth herein for termscontained in such claims shall govern the meaning of such terms as usedin the claims. Hence, no limitation, element, property, feature,advantage or attribute that is not expressly recited in a claim shouldlimit the scope of such claim in any way. The specification and drawingsare, accordingly, to be regarded in an illustrative rather than arestrictive sense.

In addition, in this description certain process steps may be set forthin a particular order, and alphabetic and alphanumeric labels may beused to identify certain steps. Unless specifically stated in thedescription, embodiments are not necessarily limited to any particularorder of carrying out such steps. In particular, the labels are usedmerely for convenient identification of steps, and are not intended tospecify or require a particular order of carrying out such steps.

What is claimed is:
 1. A solder ball bonding tool, comprising: atranslatable feed mechanism comprising: an upward pressurized gasdelivery mechanism for upwardly translating said feed mechanism, adownward pressurized gas delivery mechanism for downwardly translatingsaid feed mechanism, a solder ball pressurized gas delivery mechanism, acentral chamber, and a translatable solder ball reservoir configured forhousing solder balls, wherein said solder ball pressurized gas deliverymechanism supplies pressurized gas through said central chamber of saidfeed mechanism into said reservoir; a rotatable feed plate having aplurality of holes for receiving a solder ball from said reservoir viasaid pressurized gas through said central chamber and for feeding saidsolder ball into a nozzle unit and for guiding laser light from a laserlight source onto said solder ball; and said nozzle unit configured fordirecting said solder ball into a nozzle and ejecting said solder ballfrom said nozzle onto a work piece.
 2. The solder ball bonding tool ofclaim 1, wherein said feed mechanism is driven upward via pressurizedgas supplied through said upward delivery mechanism to translate saidreservoir upward and said feed mechanism is driven downward viapressurized gas supplied through said downward delivery mechanism totranslate said reservoir downward.
 3. The solder ball bonding tool ofclaim 1, wherein said reservoir is positioned below said feed plate witha gap in between, and wherein said reservoir is translatable in avertical direction across most of said gap into near contact with saidfeed plate.
 4. The solder ball bonding tool of claim 3, wherein amaximum size of said gap exceeds a nominal size of said solder balls. 5.The solder ball bonding tool of claim 1, further comprising: a maximumgap between said reservoir and said feed plate positioned over saidreservoir; and wherein said feed mechanism is driven upward viapressurized gas supplied through said upward delivery mechanism totranslate said reservoir upward across at least a portion of saidmaximum gap in preparation for movement of a solder ball into one ofsaid holes of said feed plate, and wherein said feed mechanism is drivendownward via pressurized gas supplied through said downward deliverymechanism to translate said reservoir downward in preparation forrotation of said feed plate after said solder ball is moved into saidone hole.
 6. The solder ball bonding tool of claim 1, wherein said feedplate is configured with a plurality of first holes for receiving saidsolder ball from said reservoir and for feeding said solder ball into anozzle unit and a plurality of second holes separate from said pluralityof first holes and for providing an aperture for said laser light toirradiate said solder ball.
 7. The solder ball bonding tool of claim 6,wherein said first and second holes are configured alternately in saidfeed plate.